What are the common errors in process welding in SMT chip processing

Craftsmanship welding, patching, and repair are essential skills in SMT chip processing. So will there be any unexpected or overlooked incidents during our SMT chip processing?

1. Excessive pressure and poor heat transfer will only cause iron oxidation at the head, forming dents and causing the solder pad to tilt upwards.   

2. The incorrect size, shape, and length of the soldering iron head can affect its thermal capacity and affect students' ability to touch the building area.   

If the temperature is too high and the welding time is too long, it will cause the weld to fail, and then add the thickness of the intermetallic compound.   

4. The wire is not placed in the correct position to form the thermal bridge. The transfer of solder cannot effectively transfer heat.   

5. Improper use of welding flux. Excessive flux may cause corrosion and electromigration.   

6. Unnecessary modifications and rework may add intermetallic compounds, affecting the strength of the solder joint.   

7. The method of carrying and welding skills will not only make the flux evaporate early, but can not be directly used in the welding of through-hole components. Welding SMD can be selected.   

Handling welding is one of the methods to solve problems encountered in SMT process. Handling welding refers to the method of first melting a small amount of solder on the welding line with a soldering iron head, and then welding with a soldering iron head. This method is often used in traditional craft welding and is a wrong approach. Because the temperature of the soldering iron is very high, the flux in the welding wire will evaporate early before welding, and the solder cannot function as the solder, which then affects the quality of the solder joint.