Solution to PCBA processing problems

What are the solutions to problems in PCBA processing? The technicians of PCBA processing company have summarized the following key points for us:

1. Material issues:

These include chemical materials for soldering, such as flux, oil, tin, cleaning materials, and coating materials for PCB. Such as anti oxidation resin, temporary or permanent anti welding ink, and printing ink.

2. Poor solderability:

This touches all aspects of solder appearance, such as parts (including externally adhered parts/SMT parts), PBC, and electroplated through-holes, which must be considered.

3. Errors in production equipment:

Including errors in machine equipment and repairs, as well as external factors such as temperature, conveyor belt speed and angle, as well as immersion depth, are variables directly related to the machine. In addition, external factors such as ventilation, pressure drop, and voltage degradation must also be included in the analysis plan.

PCBA processing process flow:

1. PCBA processing single-sided surface assembly process: solder paste printing patch reflow welding;

2. PCBA processing double-sided surface assembly process: A-side printing solder paste patch reflow soldering flap B-side printing solder paste patch reflow soldering;

3. PCBA processing single side mixed packaging (SMD and THC are on the same side): solder paste printing - patch - reflow soldering - manual plug-in (THC) - wave soldering;

4. Single sided mixed packaging (SMD and THC are respectively on both sides of the PCB): B-side printing red adhesive - mounting - red adhesive curing - flip board - A-side plug-in - B-side wave soldering;

5. Double side mixing equipment (THC is on side A, and there is SMD on both sides of A and B): A-side printing solder paste - patch - reflow soldering - flip plate - B-side printing red glue - patch - red glue curing - flip plate - A-side plug-in - B-side wave soldering;

6. Double side mixed packaging (SMD and THC are available on both sides of A and B): A-side printed solder paste - patch - reflow soldering - flip plate - B-side printed red glue - patch - red glue curing - flip plate - A-side plug-in - B-side wave soldering - B-side plug-in is attached behind.

In the soldering process, small variables should belong to machine equipment. Therefore, in order to achieve correct viewing, independent electronic sensors can be used to assist, such as using a thermometer to detect various temperatures and using an electricity meter to accurately calibrate machine parameters.

Identify suitable operating conditions from practical assignments and records.

Attention: In any case, try not to adjust the machine equipment to overcome some short-term soldering problems, as such adjustments may lead to major problems!