SMT Chip Processing Phenomenon and Solutions

With the development of electronic products towards miniaturization, the size of SMT components is becoming smaller and smaller, and the requirements for the processing environment of sensitive components are also increasing, putting higher demands on SMT chip processing. As an SMT SMT factory with outstanding work and quality control, in addition to strict control of the process flow, it is also necessary to strictly control the environment of the SMT workshop.

1. Reverse the orientation of SMT printing

Reason: The main reason we need to consider is poor alignment between the template and PCB, as well as poor manufacturing of the template, and in another case, the printing accuracy of the printing machine is indispensable.   

Impact: Simply cause bridge connection.   

Solution: Adjust the template orientation and adjust the printing machine

2. Lack of solder paste filling amount

The lack of filler is due to the lack of solder paste on printed circuit board pads. Lack of filling, lack of welding, lack of welding, and depressions are all reasons for the lack of filling quantity. Due to factors such as printing pressure, scraper speed, off grid conditions, solder paste function and conditions, template making methods, and poor template cleaning, reasonable printing conditions are crucial.   

3. Immersion phenomenon on the patch

Immersion is the penetration of flux around the solder pad. The reason is that the pressure on the printing blade is too high, and the blank space between the template and printed circuit board is too large. It is necessary to adjust the printing parameters and clean the template in a timely manner.   

4. Bridging phenomenon

Bridging is the phenomenon of solder paste being printed onto adjacent pads. Possible reasons include the orientation and deviation of the template and PCB, high printing pressure, large printing space, and poor quality of the template. It is necessary to adjust one's printing technical parameters reasonably and provide timely cleaning for the template.

5. The solder paste pattern has depressions

Reason: Excessive pressure on the scraper, such as low hardness of the rubber scraper and large template window.   

Influencing factors: welding quantity is not allowed, simple false welding occurs, and welding joint strength is not allowed.   

Solution: Adjust the printing pressure; Replace the metal scraper; Improve template window planning.   

6. Too much solder paste

Reason: The template window size is too large; There is a large gap between the template and PCB.   

Impact: Simply form a bridge connection.   

Solution: Check the template window specifications; Schedule printing parameters, especially PCB template space.