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SMT processing and production, also known as Surface Mount technology (SMT), is a new generation of electronic assembly skills developed from hybrid integrated circuit skills. It is characterized by the use of surface mounting skills and reflow soldering skills of components, and has become a new generation of assembly skills in the production of electronic products. The main equipment of smt production line includes: printing machine, mounter (upper surface electronic components), reflow soldering soldering, plug-in, wave oven and test packaging. The widespread application of SMT has promoted the miniaturization and versatility of electronic products, providing conditions for large-scale production and low defect rates. SMT is a new generation of electronic assembly skills developed from hybrid integrated circuit skills.
The process flow of SMT processing and production
1. Silk screen printing: Its function is to print solder paste or adhesive leakage on the PCB pad for soldering components. The equipment used is the silk screen printing machine (screen printing machine) located at the forefront of the SMT production line.
2. Glue dispensing: It is the process of dropping glue into the fixed position of the PCB, and its primary function is to fix the components on the PCB board. The equipment used is a dispensing machine, located at the forefront of the SMT production line or at the back of the testing equipment.
3. Installation: Its function is to accurately install the external assembled components onto the fixed orientation of the PCB. This device is a SMT placement machine located behind the screen printing machine in the SMT production line.
4. Curing: Its function is to dissolve the patch adhesive, so that the assembled components on the surface can firmly adhere to the PCB board. The equipment used is a curing furnace, located behind the SMT production line's SMT placement machine.
5. Reflow soldering: it is used to melt the solder paste, so that the external assembly components and PCB board stick together. The equipment used is a reflow soldering furnace, which is located behind the SMT placement machine in the SMT production line.
6. Cleaning: It is used to remove welding residues harmful to human body on the assembled PCB board, such as flux. The equipment used is a cleaning machine, which has an unstable orientation and can be online or offline.