SMT is a surface assembly technology that is currently the most popular technology and process in the electronic assembly industry. SMT chip processing mainly refers to pasting components printed with glue or solder paste onto a PCB through a bonding device, and then through a soldering furnace. SMT chip processing has been recognized by manufacturers for its high assembly density, small electronic product size, and good high-frequency characteristics.

Because the efficient work efficiency and stable performance of the SMT machine have brought great advantages to our production, with the SMT machine, we can greatly improve production efficiency and provide customers with high-quality products. The SMT mounting machine wants to be a robotic mounting machine, which is a precision automated production equipment. Therefore, it is necessary to understand the operating precautions of the SMT machine.

SMT chip processing operations and precautions;

Before operating the SMT machine, it is necessary to understand the commonly used labels of the SMT machine.

2. Before starting the SMT machine, the operator should conduct a comprehensive inspection of the machine;

3. The starting operation sequence of the SMT machine must be strictly followed. The SMT machine must have detailed operating instructions;

4. Timely and regularly troubleshoot and maintain the SMT machine.

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Advantages of SMT chip processing:

1. Small size of electronic products

The volume of chip components is only about 1/10 that of traditional plug-in components. After SMT chip processing, the volume of electronic products is reduced by 40%~60%.

2. Efficiency and Low Cost

SMT chip processing is easy to achieve automation, improve production efficiency, save materials, energy, equipment, manpower, and time, and reduce costs by 30% to 50%.

3. Lightweight

The weight of the SMD component is only 10% of that of traditional plugins, and after SMD, it generally reduces by 60% to 80%.

4. High reliability and strong vibration resistance.

5. Good high-frequency characteristics and reduced electromagnetic and radio frequency interference.

6. Low defect rate of solder joints.